Services
ATMP Services
Lab Infra
OSAT Partnerships
ATMP services
Services
Test Development:
Designing and developing test programs and methodologies to assess the performance and functionality of semiconductor chips.
Wafer Testing:
Conducting tests on semiconductor wafers to identify defects and ensure the quality of individual chips before they are packaged.
Package Testing:
Testing individual semiconductor chips after they have been packaged to verify functionality and reliability.
Burn-in Testing:
Subjecting semiconductor chips to extended periods of stress testing to identify potential defects and ensure reliability over time.
Reliability Testing:
Evaluating the long-term performance and reliability of semiconductor chips under various operating conditions and environmental stresses.
Testers:
Advantest V93K tester, Teradyne' ETS 364 and J750 testers with Tri-temp 12" wafer probers and Tri-Temp package handlers.
Qual Infra:
HTOL Thermal Chambers, HAST Chambers, Autoclave Chambers , Wire bond pull/ Shear Tester, ESD/Latch-up Tester,
Failure Analysis Infra::
Microprober, 3D X ray, C-SAM, Scanning Electron Microscope, Digital Microscope with 6000x Zoom, I-V Curve Tracer.. etc..